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1.5W/Mk High Performance Thermal Gap Pad For Memory Modules

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1.5W/Mk High Performance Thermal Gap Pad For Memory Modules

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Brand Name : Ziitek

Model Number : TIF1100-02F Series

Certification : UL & RoHS

Place of Origin : China

MOQ : 1000pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 1000000 pcs/month

Delivery Time : 3-5 work days

Packaging Details : 24*23*12cm cantons

Construction & Compostion : Ceramic filled silicone elastomer

Specific Gravity : 2.23 g/cc

Hardness : 55 Shore 00

name : silicone thermal pad TIF1100-02F Series

Volume Resistivity : 4.0X10" Ohm-meter

Thermal conductivity : 1.5W/m-K

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New type Outstanding thermal performance thermal gap pad for Memory Modules

Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

The TIF1100-02F Series maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography.

Features

Available in varies thicknesses
Broad range of hardnesses available
Moldability for complex parts
Outstanding thermal performance
High tack surface reduces contact resistance
RoHS compliant

Applications

notebook
power supply
Heat pipe thermal solutions
Memory Modules
Mass storage devices
Automotive electronics
Set top boxes
Audio and video components
IT infrastructure
GPS navigation and other portable devices
CD-Rom, DVD-Rom cooling

Typical Properties of TIF1100-02F Series
Color
Gray white
Visual
Composite Thickness
Thermal Impedance @10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20
Specific Gravity
2.23 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness range 0.010"-0.200"
ASTM C351
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
55 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Dielectric Breakdown Voltage

 >1000 VAC
ASTM D412
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Outgassing(TML)
0.30%
ASTM E595
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
5.5 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
4.0X10"
Ohm-meter
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
1.5W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Standard Sheets Sizes:


8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:


Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.


Reinforcement:


TIF™ series sheets type can add with fiberglass reinforced.

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

16" x 18"(406mm x 457mm)

TIF™ series Individual die cut shapes can be supplied.

1.5W/Mk High Performance Thermal Gap Pad For Memory Modules

TIF100-02F-Datasheet-REV02.pdf


Product Tags:

1.5W/Mk Thermal Gap Filler Pad

      

Thermal Gap Pad For Memory Modules  

      

UL Thermal Gap Filler Pad

      
Quality 1.5W/Mk High Performance Thermal Gap Pad For Memory Modules for sale

1.5W/Mk High Performance Thermal Gap Pad For Memory Modules Images

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